具體要求：
工作要求：
（1） Technical background of EMC, molding assembly and test process
? Knowledge or experience with Epoxy molding compound materials
? Understanding and experience with scientific molding principles
? Knowledge of automation, transfer injection molding, and molding assembly methods
? Knowledge of relative Reliability and Moldability test performance and method
（2） Minimum three 3 years EMC engineering or semiconductor back-end molding process careers
（3） Be familiar with semiconductor customer and EMC manufacturer
（4） Skills in customer communications and presentations
（5） Personal characteristics : Self motivated, independent, open mind to communicate, be willing to take risk
（6） Willing to travel according to work situation, including travel abroad
崗位職責：
（1） Provide leadership for projects and technical support of EMC for Semiconductor packaging
（2） Lead evaluation and document validation of existing mold compound and new products
（3） Troubleshoot day-to-day molding problems； implement appropriate molding process/tooling solutions to customers
（4） Assist in the transition of new products from R&D into production
（5） Assist in the specification, procurement, and promotion of mold compounds to Semiconductor packaging companies
（6） Develop new customers or potentials, and strengthen good business relationship with the existing customers
產品信息：http://www.kccworld.co.kr/eng/business/emc.asp
崗位職責：
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